Izicelo ezi-8 eziqhelekileyo zePrecision Granite Components kwiSemiconductor Equipment

Kwizixhobo ze-semiconductor, isakhiwo sesiseko siyinxalenye yebhajethi yokuchaneka. Isixhobo sokuhlola i-wafer, iqonga lokucubungula nge-laser okanye inqanaba le-metrology asidingi kuphela isakhiwo esichanekileyo ngokwemilinganiselo ngosuku lokuqala. Sifuna isakhiwo esigcina i-geometry yaso ngemijikelo yobushushu, simelane nokungcangcazela, sigcine ubudlelwane baso bokuhlanganisa, kwaye sihlala sicocekile kwindawo elawulwayo. Loo mxube weemfuno yingakho i-precision granite ibe yinto eqhelekileyo yokwakha kulo lonke ishishini le-semiconductor.

Ngezantsi kukho iindlela ezisibhozo zokusetyenziswa eziqhelekileyoizinto zegranite ezichanekileyokwizixhobo ze-semiconductor, nakwinto nganye: iindawo eziqhelekileyo ezibandakanyekayo, iingxaki zobunjineli ezigqiba impumelelo, kunye noko umthengisi afanele akunike. Ukuba uyila isixhobo esitsha, olu luluhlu lokuhlola oluya kubuzwa.

Isiseko esikhulu segranite esenziwe ngomatshini esineepokotho ezisikiweyo kunye nezinto ezifakwe ngemisonto - isiseko solwakhiwo lwemodyuli yezixhobo ze-semiconductor.

1. Iziseko zoVavanyo lweWafer kunye nezixhobo zeOptical Metrology

Ukuhlolwa kwamehlo, uphononongo lweziphene kunye neenkqubo zokulinganisa ezibonakalayo zonke zifuna into enye: ukufakwa okuzinzileyo kunye nesalathiso sokulinganisa phantsi kwe-optics enesisombululo esiphezulu. Naluphi na ukunyakaza okuncinci kwesiseko kuba yingxolo kumfanekiso.

• Izinto eziqhelekileyo:isiseko segranite, ikholamu, ibhulorho, umphezulu wokufakelwa kwereyile ye-optical, izinto ezifakelwe ngemisonto.
• Ingqwalasela yobunjineli:ukuthamba kweplani yesalathiso se-optical, ukufana phakathi kweendawo zokufaka, ukuchaneka kwendawo yomngxuma, uzinzo lobushushu, ulawulo lokungcangcazela.
• Oko kunikezelwa yiZHHIMG:ukukhethwa kwezinto, umatshini wokwakha, ukuleqa ngokuchanekileyo, ukufakwa kokufakwa, kunye neengxelo zokuhlolwa kobukhulu bayo yonke indawo ebalulekileyo.
• Ukuba ubuza:Imizobo ye-2D/3D, umthwalo obonakalayo, ukuphindaphindwa kwethagethi, uluhlu lobushushu bendalo.

2. Amaqonga okuphatha iiWafer kunye nokubeka iiNdawo ngokuchanekileyo

Izigaba ze-XY, iiplatifomu zeemoto ezithe ngqo kunye neendlela zokubeka izinto ngokuchanekileyo zifuna i-datum eqinileyo yoomatshini engashukumiyo ngelixa isiteji sikhawuleza kwaye sihla kangangamawakawaka amaxesha ngeyure.

• Izinto eziqhelekileyo:ipleyiti yesiseko segranite, igraniteibhedi yomatshini, iireli zokufaka iireyile zesikhokelo ezithe tye, iiphedi zokufaka iimoto.
• Ingqwalasela yobunjineli:ukuthe tye kunye nokuthe tye kwezihlalo zesikhokelo, ukuthe nkqo phakathi kwee-axes, amandla okutsalwa ngaphandle, ukudambisa ukungcangcazela okubangelwa sisigaba.
• Oko kunikezelwa yiZHHIMG:ukuchwetheza izihlalo zikaloliwe ukuze zikwazi ukunyamezelana, ufake ufakelo oluneenkcukacha ze-torque, idatha yokulinganisa i-modal kunye ne-flatness.
• Ukuba ubuza:istroke, umthwalo, iprofayili yokukhawulezisa, ukuchaneka kokubeka ithagethi, ulwalathiso lofakelo.

3. Izixhobo zeZakhiwo ze-AOI

Izixhobo zokuhlola ezibonakalayo ezizenzekelayo zidibanisa imifanekiso enesisombululo esiphezulu kunye nokuhamba ngokukhawuleza. Isiseko, umqadi kunye nekholamu zithwala iikhamera kunye nezibane, kwaye isakhelo sokudibanisa sigcina yonke imodyuli ihambelana nejometri.

• Izinto eziqhelekileyo:isiseko segranite, umqadi onqamlezileyo, ikholamu, ubuso bokufakelwa kwekhamera kunye nesensor, iindawo zokudibanisa iifreyimu zendibano.
• Ingqwalasela yobunjineli:isikwere sekholamu ukuya kwisiseko, ukufana kwemitha, ukuchaneka komngxuma kunye nendawo yesloti, uzinzo lwejometri lwexesha elide.
• Oko kunikezelwa yiZHHIMG:iiseti zesakhiwo ezenziwe ngomatshini nezidibeneyo, iindawo zesinyithi ezidibanayo, ukuhlanganiswa kwangaphambili kwefektri kunye nokuqinisekiswa kwejometri ngaphambi kokuthunyelwa.
• Ukuba ubuza:Idatha yeCAD, uyilo lwekhamera kunye nokukhanya, i-envelope yokuhamba, yayifuna uzinzo lomfanekiso.

4. Iziseko zeNkqubo zoHlolo lwe-Industrial CT kunye ne-X-Ray

Iinkqubo ze-Industrial CT kunye ne-X-ray zibeka umthombo, inqanaba lokuguqulwa kunye nesixhobo sokubona kwisakhiwo esinye. Naluphi na ukunyakaza phakathi kwezi zintathu kubonakala njengempazamo yomfanekiso.

• Izinto eziqhelekileyo:isiseko segranite, ipleyiti yokufaka isiteji esijikelezayo, iikholamu zomthombo kunye nezokuxilonga, iindawo zokudibanisa ukhuselo lwemitha.
• Ingqwalasela yobunjineli:i-datum yokulungelelanisa i-coaxial phakathi komthombo, inqanaba kunye nesixhobo sokufumanisa, ukuba sithe tyaba kwesihlalo se-axis yokujikeleza, ulawulo lokungcangcazela, ukuchaneka kwendawo yomngxuma.
• Oko kunikezelwa yiZHHIMG:umatshini wokwenza izinto ezininzi ngedatha yokulungelelanisa, ufakelo, ingxelo epheleleyo eneemeko zokulinganisa ezichaziweyo.
• Ukuba ubuza:umgama wesixhobo sokufumanisa umthombo, umthwalo ojikelezayo, ithagethi yesisombululo, indawo yomgangatho kunye nendlela yokufakela.

5. Amaqonga okuSebenza ngeLaser kunye nokuLinganisa ngeLaser

Umatshini we-laser we-Femtosecond kunye ne-picosecond, ukumakisha ngokuchanekileyo, ukulungelelaniswa kwe-optical kunye nezixhobo zokulinganisa i-laser zonke ezi zigxila kumgca we-beam olinganiswe kwii-microns. Iqonga eliphantsi kwe-optics akufuneki lishukumise umqadi.

• Izinto eziqhelekileyo:iqonga legranite, inkxaso yentloko ye-optical, iireli zokufaka indlela ye-beam, itafile yomsebenzi.
• Ingqwalasela yobunjineli:ukuthamba kweplani yokufakelwa kwe-optical, uzinzo lobushushu phantsi kweemeko ze-laser ezivalekileyo, ukudambisa ukungcangcazela okuphezulu.
• Oko kunikezelwa yiZHHIMG:igranite ecolekileyo ekhethelwe ukufunxa, iindawo zokufaka ezikhanyayo, ukudityaniswa ne-honeycomb okanye izakhiwo zentsimbi xa kufuneka.
• Ukuba ubuza:ubude bomda kunye namandla e-laser, uyilo lwe-optical, indawo yokusebenza, iimfuno zococeko.

6. I-CMM, Izixhobo zokulinganisa ividiyo kunye neMetrology echanekileyo

I-granite ibisoloko isetyenziswa njengesixhobo esiqhelekileyo kwi-metrology: iitafile zomsebenzi, iindlela zokubonisana, iikholamu, iibhulorho kunye neziseko ze-CMMs, oomatshini bokulinganisa ividiyo kunye nezinye izixhobo zokulinganisa ngokuchanekileyo zixhomekeke ekuzinzeni nasekukwazini kwayo ukugoba.

• Izinto eziqhelekileyo:itafile yokusebenza,ukulinganisa ngokuchanekileyoimiphezulu yereferensi, izakhiwo zebhulorho kunye neekholamu, izihlalo zesikhokelo.
• Ingqwalasela yobunjineli:ukuthamba kwetafile yokulinganisa kwinqanaba le-micron, ukuthe tye kwezihlalo zesikhokelo xa uhamba ngokupheleleyo, ukumelana nokuguguleka xa udibana nokutyibilika.
• Oko kunikezelwa yiZHHIMG:imiphezulu ejikeleziweyo ngesandla enemephu ezithe tyaba, izatifikethi zokulinganisa ezilandelelwa kwisixhobo esisetyenzisiweyo, ukugoba okukhethwayo okufanisiweyo.
• Ukuba ubuza:uluhlu lokulinganisa, udidi lokuchaneka, injongo ye-MPE, imigangatho efanelekileyo.

7. Amaqonga okuHamba okuNgqongileyo kweeBearing zoMoya

Iibheringi zomoya zihamba kwifilimu ecinezelweyo engenakho ukudibana okuqinileyo, nto leyo enciphisa ukungqubana kunye nokuguguleka kufutshane no-zero. Igranite engaphantsi kwebheringi yomoya ayilobhloko engasebenziyo: umgangatho wayo womphezulu uchaza ngokuthe ngqo indlela ifilimu eziphatha ngayo.

• Izinto eziqhelekileyo:isiseko segranite esineentambo ezirhangqiweyoukuthwala umoyaimiphezulu, iireyile ezikhokelayo, izixhobo zegranite ezibalaseleyo zezixhobo ezijikelezayo nezithe tyaba, izakhiwo zeqonga ezichanekileyo kakhulu.
• Ingqwalasela yobunjineli:ukugqitywa komphezulu kunye nokuba tyaba kobuso befilimu yomoya, iimbobo kunye nolawulo lweziphene ezincinci, ukufana phakathi kobuso beebhereyini ezichaseneyo, ukuzinza kwexesha elide.
• Oko kunikezelwa yiZHHIMG:Ubuso obunomoya ojikelezileyo nobucwebezelayo obunejometri eqinisekisiweyo, iiseti zomphezulu ezihambelanayo, kunye nokupakishwa okuhambelana negumbi lokucoca.
• Ukuba ubuza:uyilo lwefilimu yomoya, umthwalo kunye nomthwalo wangaphambili, uhambo, ukuthe tye okanye ukujikeleza kwethagethi.

8. Amaqonga Okuhlanganisa Iimodyuli zeeModules zeZixhobo zeSemiconductor

Ukuhlanganiswa kokugqibela kweemodyuli ezichanekileyo kakhulu kwenzeka phantsi kobushushu obulawulwayo, ukufuma kunye nokungcangcazela, rhoqo kwigumbi lokucoca. Amaqonga egranite asebenza njengedatum yokuhlanganisa apho iindawo zegranite, iindawo zesinyithi, iindawo zeseramikhi, iireli, izinto zokuthwala umoya kunye neemodyuli zokuhamba zidityaniswe khona.

• Izinto eziqhelekileyo:iiplatifomu zokuhlanganisa igranite eziziimodular, izixhobo zokudibanisa kunye nezixhobo, iindawo zokubeka iimodyuli.
• Ingqwalasela yobunjineli:ukuhambelana kwedatha kuzo zonke iimodyuli, ukuchaneka kokufakwa kunye nokuchaneka kwedowel, ukuhambelana neemeko zokuhlanganisa igumbi lokucoca.
• Oko kunikezelwa yiZHHIMG:igumbi lokucocaukuhlanganisa, ukuhlola kunye nokulinganisayeemodyuli ezipheleleyo, ezidibanisa i-granite, isinyithi kunye nezinto ze-ceramic kwindibano eqinisekisiweyo.
• Ukuba ubuza:uluhlu lweemodyuli, iklasi yococeko, ulandelelwano lokuhlanganisa, iikhrayitheriya zokugqibela zokuhlola.

Uluhlu olunye lokujonga ubuNjineli kuzo zonke izicelo ezisibhozo

Kuzo zonke ezi zicelo, imibuzo yobunjineli ihlala ifana: yeyiphi i-geometry ekufuneka ibambe, ibekwe kweyiphi indawo, ibekwe phantsi kweyiphi indawo yobushushu kunye nokungcangcazela, kwaye ixesha elingakanani. Umthengisi wegranite onokuphendula ngedatha elinganisiweyo - iimephu zokuthamba, iingxelo zezinto zebhetshi, iirekhodi ze-torque yokufaka - ngumthengisi onokuhlolwa. I-ZHHIMG iyaxhasaizixhobo ze-semiconductorabavelisi abanendlela efanayo.

I-ZHHIMG® ixhasa abavelisi bezixhobo ze-semiconductor ngeziseko zegranite ezenziwe ngokwezifiso, iifreyimu, iindlela zokuhamba, izakhiwo ezithwala umoya kunye neendibano ezichanekileyo ezihlanganisiweyo. Qhagamshelana nathi ngomzobo wakho ukuze uvavanye ubunjineli.