Kwikhonkco elichanekileyo lokwenziwa kwe-semiconductor, inkqubo yokudlulisa i-wafer ifana "nendlela yokuphila yomgca wokuvelisa i-chip", kwaye ukuzinza kwayo kunye nokuchaneka kwayo kuqinisekisa ngokuthe ngqo izinga lesivuno seetshiphusi. Isizukulwana esitsha seenkqubo zokuhanjiswa kwe-wafer ngokuguqukayo sidibanisa iimotor ezinearnear kunye neziseko zegranite, kwaye izibonelelo ezikhethekileyo zemathiriyeli yegranite kanye yikhowudi ephambili yokuvula ukuhanjiswa okuphezulu kokusebenza.
Isiseko segranite: Ukwakha "isiseko esiluqilima" sothumelo oluzinzileyo
I-Granite, esele idlule kumakhulu ezigidi zeminyaka yokucocwa kwejoloji, ibonakalisa ubucwebe obuxineneyo nobufanayo bangaphakathi. Olu phawu lwendalo luyenza ibe sisixhobo esisisiseko esifanelekileyo kwiinkqubo zokudluliselwa kwe-wafer. Kwiindawo eziyinkimbinkimbi zamagumbi ahlambulukileyo e-semiconductor, i-granite, kunye ne-ultra-low coefficient yokwandiswa kwe-thermal (kuphela i-5-7 × 10⁻⁶/℃), inokumelana nobushushu obuveliswa ngexesha lokusebenza kwezixhobo kunye nefuthe lokutshintsha kobushushu bendalo, ukuqinisekisa ukuzinza kobukhulu besiseko kunye nokuphepha ukuphambuka kwendlela yokudlulisa okubangelwa ukuphambuka okubangelwa ukuphambuka. Ukusebenza kwayo okugqwesileyo kwe-vibration damping kungafunxa ngokukhawuleza ukungcangcazela komatshini okwenziwa ngexesha lokuqalisa, ukuvalwa kunye nokukhawuleziswa kweenjini zelinear, kunye nokuphazamiseka kwangaphandle okuziswa kukusebenza kwezinye izixhobo kwindawo yokusebenzela, ukubonelela ngeqonga elizinzileyo kunye ne "zero shake" yokuhanjiswa kwe-wafer.
Okwangoku, ukuzinza kweekhemikhali ze-granite kuqinisekisa ukuba ayinayo i-corrode okanye i-rust kwii-workshops ze-semiconductor apho i-asidi kunye ne-alkali reagents ziguquguqukayo kunye nokucoceka okuphezulu kuyadingeka, ngaloo ndlela kugwenywe impembelelo ekugqithiseni ukuchaneka ngenxa yokuguga kwezinto okanye i-adsorption engcolileyo. Iimpawu zomphezulu ogudileyo kunye noxineneyo zinokunciphisa ngokusebenzayo ukuncamathelisa uthuli, ukuhlangabezana nemigangatho engqongqo engenathuli yamagumbi acocekileyo kunye nokuphelisa umngcipheko wokungcoliseka kwe-wafer kwingcambu.
Impembelelo "yentsebenziswano yegolide" yeenjini zemigca kunye negranite
Iinjini ze-Linear, ezineempawu zazo zokungabikho kwemvume yokuhambisa ngoomatshini, isantya esiphezulu kunye nesantya esiphezulu sokuphendula, ukuhanjiswa kwe-wafer kunye nezibonelelo "zokukhawuleza, zichanekileyo kwaye zizinzile". Isiseko segranite sibonelela ngesiseko esiqinileyo nesithembekileyo senkxaso yalo. Bobabini basebenza kunye ukuphumeza umtsi ekusebenzeni. Xa i-motor ye-linear iqhuba i-wafer carrier ukuba iqhube kumzila wesiseko se-granite, ukuqina okuqinileyo kunye nokuzinza kwesiseko kuqinisekisa ukuhanjiswa okusebenzayo kwamandla okuqhuba i-motor, ukuphepha ukulahlekelwa kwamandla okanye ukuhanjiswa kwe-lag okubangelwa ukuguqulwa kwesiseko.
Iqhutywa yimfuno yokuchaneka kwe-nanoscale, iimotor zelinear zinokufezekisa ulawulo lokufuduswa kwe-sub-micron-level. Iimpawu eziphezulu zokuchaneka kweziseko zegranite (ezineempazamo zokucaba ezilawulwa ngaphakathi ± 1μm) zihambelana ngokugqibeleleyo nolawulo oluchanekileyo lweemotor ezihambelanayo, ngokudibeneyo ukuqinisekisa ukuba impazamo yokumisa ngexesha lokuhanjiswa kwe-wafer ingaphantsi kwe-± 5μm. Nokuba kukuhamba ngesantya esiphezulu phakathi kwezixhobo ezahlukeneyo zenkqubo okanye indawo yokupaka echanekileyo yonikezelo lwe-wafer, indibaniselwano yeenjini zemigca kunye neziseko zegranite zinokuqinisekisa "iqanda elitenxileyo kunye ne-zero jitter" ekuhanjisweni kwe-wafer.
Ukuqinisekiswa kokusebenza kweshishini: Uphuculo oluphindwe kabini ekusebenzeni kakuhle kunye nenqanaba lesivuno
Emva kokuphucula inkqubo yokudlulisa isiqwenga se-wafer, ishishini le-semiconductor lehlabathi elihamba phambili lamkele isisombululo sesiseko se-motor + + granite, esonyusa ukusebenza kakuhle kokuhanjiswa kwe-wafer ngama-40%, sanciphisa izinga lokwenzeka kweempazamo ezinje ngokungqubana kunye ne-offset ngexesha lenkqubo yokudluliselwa ngama-85%, kwaye laphucula umyinge wesivuno seetships nge-6%. Emva kwedatha kukho isiqinisekiso sozinzo lothumelo olunikezelwa yisiseko segranite kunye nesantya esiphezulu kunye nesiphumo esichanekileyo se-synergy yemoto yomgca, enciphisa kakhulu ilahleko kunye nephutha kwinkqubo yokuhanjiswa kwe-wafer.
Ukusuka kwiipropathi zemathiriyeli ukuya kwimveliso echanekileyo, ukusuka kwizibonelelo zokusebenza ukuya kuqinisekiso olusebenzayo, indibaniselwano yeenjini zemigca kunye neziseko zegranite zichaze ngokutsha imigangatho yeenkqubo zokudluliselwa kwe-wafer. Kwixesha elizayo xa iteknoloji ye-semiconductor iqhubela phambili ukuya kwiinkqubo ze-3nm kunye ne-2nm, imathiriyeli yegranite ngokuqinisekileyo iya kuqhubeka ukufaka amandla anamandla kuphuhliso loshishino ngeenzuzo zabo ezingenakubuyiselwa.
Ixesha lokuposa: May-14-2025