Njengoko ishishini le-semiconductor lilandela ngamandla ii-node zenkqubo ze-sub-2nm, umda wempazamo yoomatshini uphelile ngokupheleleyo. Kule meko inzima, ukuzinza kwegumbi lenkqubo akusekho nto ibalulekileyo; yeyona nto iphambili ekufumaneni isivuno. Kwi-ZHHIMG, sibona utshintsho olukhulu kwindlela ii-OEM zehlabathi ezijongana ngayo nomgangatho wesakhiwo sezixhobo ezinkulu ze-semiconductor.
I-Physics of Silence: Iindlela eziPhambili zokuDamping Vibration
Kwimveliso ye-wafer yanamhlanje, ukungcangcazela okwakukade kubonwa “njengengxolo yangasemva” ngoku kuyintlekele. Nokuba kukushukuma okuncinci okuvela kwinkqubo ye-HVAC yesakhiwo okanye i-inertia yangaphakathi yesigaba sokuskena esikhawulezayo, amandla angalawulwayo aguqulela ngokuthe ngqo kwiimpazamo ezigqunyiweyo kunye neepatheni ezifipheleyo.
Iindlela zangoku zokudambisa ukungcangcazela kwimveliso ye-semiconductor ziye zaguquka zaba yisakhiwo esinee-layered ezininzi. Nangona ukudambisa okungasebenziyo—ukusebenzisa izinto ezinobunzima obukhulu ezifana ne-mineral casting okanye i-precision granite—kusasisisiseko, sibona ukwanda kokuhlanganiswa kokudambisa okusebenzayo.
Iinkqubo ezisebenzayo zisebenzisa ii-actuators ze-piezoelectric kunye nee-sensors zexesha langempela "ukurhoxisa" ukungcangcazela ngokuvelisa ii-counter-frequencies. Nangona kunjalo, ukusebenza kakuhle kweenkqubo ezisebenzayo kunqunyelwe ngokwemvelo yi-damping ratio yezinto ezisisiseko. Kulapho ubuchule be-ZHHIMG kwizixhobo zokwakha ezimanzi kakhulu buba yinto ebalulekileyo. Ngokudibanisa ii-elektroniki ezisebenzayo kunye ne-granite engasebenziyo ngokwendalo okanye isiseko esidibeneyo, sibonelela "ngeNdawo eThuleyo" apho i-nano-positioning inokwenzeka ngaphandle kokuphazamiseka.
Ukunyuka kweNtshukumo engenazingxabano: Itekhnoloji yokuthwala umoya
Imfuno yokukhupha okuphezulu inyuse iibheringi zemveli zoomatshini kwimida yazo. Ukungqubana kukhokelela kubushushu, kwaye ubushushu bukhokelela ekwandeni kobushushu—utshaba lokuchaneka. Oku kukhokelele ekwamkelweni ngokubanzi kweiteknoloji yokuthwala umoya yezigaba zokuchaneka.
Iibheringi zomoya zixhasa umthwalo kwifilimu encinci yomoya oxinzelelweyo, ngesiqhelo ubukhulu bayo buzii-microns ezimbalwa. Ngenxa yokuba akukho kuthintana ngokomzimba, akukho kungqubana okungashukumiyo (i-stiction). Oku kuvumela oku kulandelayo:
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Intshukumo EngenaHysteresis: Ukuqinisekisa ukuba inqanaba libuyela kwi-nanometer coordinate efanayo ngalo lonke ixesha.
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Ukuzinza kweVelocity: Kubalulekile kwiindlela zokuskena ezifana nokuhlolwa kwe-E-beam apho nokuba "ukugoba" okuncinci kwebheyaringi yoomatshini kuya kuyiphazamisa imifanekiso.
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Ukuphila ixesha elide kakhulu: Ekubeni kungekho zinto zichukumisayo, akukho kuguga kwaye akukho kuveliswa kwamasuntswana, nto leyo eyenza ukuba afaneleke kwiindawo zokucoca zeKlasi yoku-1.
Apha kwi-ZHHIMG, senza iindawo zegranite ezithe tyaba kakhulu ezisebenza njengezikhokelo zezi bheringi zomoya. Ukuze zisebenze ngokuchanekileyo, ezi ndawo kufuneka zidibene zibe zithe tyaba zilinganiswe ngamaqhezu obude bokukhanya.
Iindlela Ezisetyenziswa Kwizixhobo Zemali Ze-Semiconductor: 2026 Nangaphaya
Njengoko siqhubeka nonyaka ka-2026,iindlela ezisetyenziswa kakhulu kwizixhobo ze-semiconductor capitalzibonakaliswa “ziintsika ezintathu”: Ukuguqulwa, Uzinzo, kunye noLawulo loBushushu.
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Uyilo lwePlatform yeModular: Ii-OEM zikhangela iimodyuli zesiseko "zeplagi-and-play". Endaweni yokuyila isiseko esitsha sesixhobo ngasinye, zisebenzisa iziseko ezichanekileyo zeZHHIMG ezinokulungiswa kwi-lithography, metrology, okanye etching.
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Ulawulo lobushushu: Njengoko imithombo yokukhanya ye-EUV (Extreme Ultraviolet) ivelisa ubushushu obukhulu, isiseko somatshini kufuneka sisebenze njengesinki esikhulu sobushushu. Sidibanisa imijelo yokupholisa enzima ngqo kwiinxalenye zethu zezimbiwa kunye negranite ukuze sigcine i-delta ye-$<0.01^\circ\text{C}$.
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Ukuhambelana kweVacuum: Njengoko iinkqubo ezininzi zisiya kwiindawo ezinevacuum eninzi, izixhobo ezisetyenzisiweyo akufuneki ziphume negesi. Ukulungiswa kwethu okukhethekileyo kwegranite kunye neceramic kuqinisekisa ukuba ukuthembeka kwevacuum akuze konakaliswe sisiseko sesakhiwo.
Intsebenziswano yoBuchule neZHHIMG
I-ZHHIMG ayisiyomveliso nje kuphela; singabalingani abaphambili kwikhonkco lokubonelela ngolawulo lokuhamba. Iziko lethu eTshayina lisebenzisana ngokusondeleyo namaqela obunjineli eSilicon Valley nase-Eindhoven ukusombulula imingeni enzima yozinzo kushishino.
Ngokusebenzisa iindlela zethu zokubopha ezizimeleyo kunye nokuqonda kwethu okunzuluiindlela zokunciphisa ukungcangcazela, senza abathengi bethu bakwazi ukutyhala imida yoMthetho kaMoore. Nokuba uphuhlisa isixhobo sesizukulwana esilandelayo se-ALD (Atomic Layer Deposition) okanye isixhobo sokuhlola i-wafer esikhawulezayo, isiseko siqala nge-ZHHIMG.
Isiphelo
Uphuhliso lwemveliso ye-semiconductor lukhuphiswano oluchasene nemithetho yefiziksi. Njengoko eli shishini lisiya kutsho ku-2026, ukugxila ekuchanekeni kokuthwala umoya kunye nokunciphisa ubushushu obuphezulu kuya kuqina ngakumbi. Ukuhlala phambili kwezi ndlela kufuna isiseko—ngokokwenyani nangokomfuziselo—esakhelwe kubuchule nakwizinto ezintsha.
Ixesha leposi: Jan-26-2026