Kwicandelo lokusika i-semiconductor wafer, impazamo ye-0.001mm inokwenza itshiphu ingasebenzi. Isiseko segranite esibonakala singabalulekanga, xa umgangatho waso ungahlangabezani nemigangatho, sityhalela imveliso yakho ecaleni komngcipheko ophezulu kunye neendleko eziphezulu! Eli nqaku likusa ngqo kwiingozi ezifihlakeleyo zeziseko ezingaphantsi komgangatho, ukukhusela ukuchaneka kokusika kunye nokusebenza kakuhle kwemveliso.
"Ibhombu engabonakaliyo" yeziseko zegranite ezingaphantsi komgangatho
1. Ukuguqulwa kobushushu obubalekayo: Umbulali obulalayo wokuchaneka
Igranite ekumgangatho ophantsi inomlinganiselo ogqithisileyo wokwanda kobushushu. Phantsi kwendawo enobushushu obuphezulu bokusika i-wafer (ukuya kuthi ga kwi-150℃ kwezinye iindawo), inokuba nokuguquguquka kwe-0.05mm/m! Ngenxa yokuguquguquka kobushushu besiseko kwisityalo esithile sokwenza i-wafer, ukuphambuka kobukhulu bee-wafers ezisikiweyo kudlule i-±5μm, kwaye izinga le-scrap ye-single-batch landa laya kwi-18%.
2. Amandla okwakha angonelanga: Ubomi benkonzo yezixhobo "buncitshiswa ngesiqingatha"
Iziseko ezingafanelekanga ezinobunzima obungaphantsi kwe-2600kg/m³ zinokunciphisa ukuguguleka nge-50% kunye nomthamo wokuthwala umthwalo ophawulwe ngokungachanekanga. Phantsi kokungcangcazela rhoqo kokusika, umphezulu wesiseko udla ngokuguguleka kwaye kuvela imifantu emincinci ngaphakathi. Ngenxa yoko, izixhobo ezithile zokusika zarhoxiswa kwiminyaka emibini ngaphambi kwexesha elicwangcisiweyo, kwaye iindleko zokutshintsha zadlula isigidi esinye.
3. Ukungazinzi kakuhle kweekhemikhali: Ukugqwala kugcwele ingozi
I-granite engahlangabezaniyo nemigangatho inokumelana nokugqwala okubuthathaka. Izinto ze-asidi kunye ne-alkali kulwelo lokusika ziya kutshabalalisa isiseko kancinci kancinci, nto leyo ebangela ukuba siwohloke. Idatha evela kwilabhoratri ethile ibonisa ukuba ngokusebenzisa iziseko eziphantsi, umjikelo wokulinganisa izixhobo uncitshisiwe ukusuka kwiinyanga ezintandathu ukuya kwiinyanga ezimbini, kwaye iindleko zokugcina zinyukile kathathu.
Ungazichonga njani iingozi? Amanqaku amane ovavanyo ekufuneka uwafunde!
✅ Uvavanyo loxinano: Uxinano lwegranite olukumgangatho ophezulu ≥2800kg/m³, i-porosity density engaphantsi kweli xabiso inokubakho;
✅ Uvavanyo lokwandiswa kobushushu oluyi-coefficient: Cela ingxelo yovavanyo ye-< 8×10⁻⁶/℃, akukho "kumkani wokuguquguquka kobushushu obuphezulu";
✅ Ukuqinisekiswa kokuthe tyaba: Xa kulinganiswa nge-laser interferometer, ukuthe tyaba kufanele kube yi-≤±0.5μm/m, kungenjalo ukugxila ekusikeni kusenokutshintsha;
✅ Ukuqinisekiswa kwesiqinisekiso esigunyazisiweyo: Qinisekisa i-ISO 9001, i-CNAS kunye nezinye iziqinisekiso, yala isiseko esithi "akukho zintathu".
Ukuchaneka kokukhusela kuqala kwisiseko!
Yonke into esikiweyo kwi-wafer ibalulekile kwimpumelelo okanye ukusilela kwetshiphusi. Musa ukuvumela iziseko zegranite ezingaphantsi komgangatho zibe "sisikhubekiso" ekuchanekeni! Cofa ukuze ufumane "i-Wafer Cutting Base Quality Assessment Manual", qaphela ngoko nangoko iingozi zezixhobo, kwaye uvule izisombululo zemveliso ezichanekileyo!
Ixesha leposi: Juni-13-2025