Kwintsimi yokusikwa kwe-wafer ye-semiconductor, impazamo ye-0.001mm inokwenza ukuba i-chip ingasebenzi. Isiseko se-granite esibonakala singabalulekanga, xa umgangatho wayo usilela ukuhlangabezana nemigangatho, ngokuzola utyhala imveliso yakho kumngcipheko ophezulu kunye neendleko eziphezulu! Eli nqaku likuthatha ngqo kwiingozi ezifihlakeleyo zeziseko ezikumgangatho ophantsi, ukukhusela ukuchaneka kokusika kunye nokusebenza kakuhle kwemveliso.
"Ibhombu engabonakaliyo" yeziseko zegranite ezingekho mgangathweni
1. Runaway deformation thermal: Umbulali obulalayo wokuchaneka
Igranite ekumgangatho ophantsi ine-coefficient egqithisileyo yokwanda kwe-thermal. Ngaphantsi kobushushu obuphezulu bokusikwa kwe-wafer cut (ukuya kuthi ga kwi-150 ℃ kwezinye iindawo), inokungena kwi-deformation ye-0.05mm/m! Ngenxa yokuguqulwa kwe-thermal yesiseko kwisityalo esithile sokwenziwa kwe-wafer, ukutenxa kobungakanani beewafa ezisikiweyo kudlule i-± 5μm, kwaye isantya se-batch scrap sinyuke saya kutsho kwi-18%.
2. Amandla angonelanga okwakhiwa: Ubomi benkonzo yesixhobo "bunesiqingatha"
Iziseko ezingafanelekanga ezinoxinano olungaphantsi kwe-2600kg/m³ zineepesenti ezingama-50 zokucutha ukuxhathisa ukunxiba kunye nomthamo wokuthwala umthwalo ngobuxoki. Ngaphantsi kwee-vibrations zokusika rhoqo, umphezulu wesiseko ulungele ukugqoka kwaye i-micro-cracks ibonakala ngaphakathi. Ngenxa yoko, isixhobo esithile sokusika sapheliswa kwiminyaka emibini ngaphambi kwexesha elimiselweyo, yaye iindleko zokusitshintsha zadlula kwisigidi esinye.
3. Uzinzo olubi lweekhemikhali: Ukonakala kugcwele ingozi
I-Granite engahambelani nemigangatho inokumelana nokugqwala okubuthathaka. Amacandelo e-asidi kunye ne-alkali kumanzi okusika aya kutshabalalisa ngokuthe ngcembe isiseko, okubangela ukuwohloka kwe-flatness. Idatha evela kwibhubhoratri ethile ibonisa ukuba ngokusebenzisa iziseko ezingaphantsi, umjikelo wokulinganisa izixhobo uncitshiswe ukusuka kwiinyanga ezintandathu ukuya kwiinyanga ezimbini, kwaye iindleko zokulondoloza ziye zanda ngokuphindwe kathathu.
Indlela yokuchonga imingcipheko? Amanqaku amane ovavanyo angundoqo ekufuneka uwafundile!
✅ Uvavanyo loxinaniso: Umgangatho ophezulu woxinaniso lwe granite ≥2800kg/m³, ngaphantsi kwesi siphene se porosity sinokubakho;
✅ I-Coefficient yovavanyo lokwandiswa kwe-thermal: Cela ingxelo yovavanyo ye- <8×10⁻⁶/℃, akukho "i-high level deformation king";
✅ Ukuqinisekiswa kwe-Flatness: Ukulinganisa nge-interferometer ye-laser, i-flatness kufuneka ibe ngu-≤± 0.5μm / m, ngaphandle koko ugxininiso lokusika luxhomekeke ekutshintsheni;
✅ Ukuqinisekiswa kwesiqinisekiso esigunyazisiweyo: Qinisekisa i-ISO 9001, i-CNAS kunye nezinye izatifikethi, ukwala isiseko "esithathu-esingekho".
Ukugada ukuchaneka kuqala kwisiseko!
Yonke inqumle kwi-wafer ibalulekile kwimpumelelo okanye ukusilela kwetshiphu. Ungavumeli iziseko zegranite ezikumgangatho ophantsi zibe "sisikhubekiso" ngokuchanekileyo! Cofa ukuze ufumane i "Wafer Cutting Base Assessment Manual", ngokukhawuleza uchonge iingozi zezixhobo, kwaye uvule izisombululo zokuvelisa ezichanekileyo!
Ixesha lokuposa: Jun-13-2025