Kwidomeyini yokwenziwa kwesemiconductor, oomatshini be-wafer grooving badlala indima ebalulekileyo ekudaleni amajelo achanekileyo kwiiwafers. Ukusebenza kwaba matshini kunokuba nempembelelo enkulu
d ngokukhethwa kwesiseko somatshini. Iziseko zomatshini we-granite ezichanekileyo eziphezulu, ezifana nezo zinikezelwa yi-ZHHIMG®, ziye zavela njengomdlalo - umtshintshi kulo mbandela.
Uzinzo kwiGrooving echanekileyo
Uzinzo lubalulekile kwi-wafer grooving. Igranite, enoxinano oluphezulu malunga ne-3100 kg/m³, ibonelela ngesiseko esizinze kakhulu. Ngethuba lenkqubo ye-grooving, isixhobo sokusika sisebenzisa amandla kwi-wafer. Isiseko somatshini esizinzile, esifana neso senziwe ngegranite, siqinisekisa ukuba i-wafer - into yokubamba i-mechanism ihlala iqinile. Oku kuzinza kunciphisa nayiphi na intshukumo engafunekiyo okanye i-vibration ye-wafer, eyenza isixhobo sokusika senze i-grooves ngokuchaneka okuphezulu. Ngokwahlukileyo, imathiriyeli yesiseko engazinzanga kangako inokubangela ukuba iwafer itshintshe kancinci, ibangele igrooves ebanzi kakhulu, emxinwa kakhulu, okanye engathanga ngqo, enokuthi ibe nefuthe elibi kakhulu ekusebenzeni kwesixhobo sokugqibela sesemiconductor.
IVibration Damping ukwenzela imisebenzi egudileyo
Ukungcangcazela ngumba wendalo kuyo nayiphi na inkqubo yomatshini, kwaye i-wafer grooving nayo injalo. Isantya esiphezulu sokujikeleza kwesixhobo sokusika kumatshini we-wafer grooving senza ukungcangcazela. Ukuba ezi ntshukumo azithotywanga ngokufanelekileyo, zinokukhokelela ekutshitshweni kwemiphetho ye-wafer, ubunzulu obungalinganiyo begroove, kunye nokuphela komphezulu obuthathaka. I-Granite ine-vibration egqwesileyo - iipropati zokudambisa. Isakhiwo sayo sendalo, esakhiwe ngeenkozo zeminerali ezidibeneyo, zisebenza njengento ephazamisayo yendalo. Xa ukunyakaza kwenzeka, amandla achithwa ngaphakathi kwegranite, ukunciphisa impembelelo kwi-wafer kunye nesixhobo sokusika. Oku kukhokelela ekusebenzeni okugudileyo kokusika, ubomi besixhobo obude, kunye nomgangatho ophezulu we-wafers grooved.
Ukunyangwa kweThermal kwiziphumo ezihambelanayo
Izixhobo zokuvelisa i-semiconductor zihlala zisebenza kwindawo ezilawulwayo, kodwa kusenokubakho ukuguquguquka okuncinci kobushushu. Igranite ine-coefficient yokwandisa i-thermal ephantsi kakhulu. Oku kuthetha ukuba njengoko iqondo lokushisa litshintsha kancinci ngexesha lenkqubo ye-wafer grooving (mhlawumbi ngenxa yokushisa okwenziwa sisixhobo sokusika okanye ukuhluka kweqondo lokushisa), isiseko somatshini we-granite asiyi kwandisa okanye isivumelwano kakhulu. Kwi-wafer grooving, apho ukunyamezelwa okuchanekileyo kukwi-micrometer okanye nakwi-nanometer range, utshintsho lwe-thermal-induced dimensional lunokuba yintlekele. Ukuzinza kwe-thermal ye-granite kunceda ukugcina ukulungelelaniswa kwamacandelo omatshini, ukuqinisekisa ukuba inkqubo ye-grooving ihlala ichanekile kwaye ihambelana nexesha.
Ukuqina kokusetyenziswa kwexesha elide
Oomatshini be-wafer grooving basetyenziswa ngokuqhubekayo kwimveliso yomthamo ophezulu we-semiconductor. Isiseko somatshini siphantsi koxinzelelo lomatshini, ukukhuhlana, kunye neempembelelo zamaxesha athile. Ubunzima obuphezulu beGranite kunye nokunxiba-indalo exhathisayo iyenza ibe yinto efanelekileyo yokusetyenziswa kwexesha elide. Inokumelana nobunzima bokusebenza kwemihla ngemihla ngaphandle kokunxiba okubalulekileyo okanye ukuguqulwa. Oku komelela kunciphisa imfuno yokutshintshwa rhoqo okanye ukulungiswa okuxabisa kakhulu ngenxa yemibandela enxulumene nesiseko. Ukongezelela, i-granite i-inert ye-chemically inert, oku kuthetha ukuba iyamelana nokubola kwiikhemikhali ezisetyenziswa kwiinkqubo zokuvelisa i-semiconductor, ngakumbi ukuphucula ubomi bayo.
Ukuqukumbela, isiseko somatshini wegranite esichanekileyo sinokuphucula ukusebenza koomatshini be-wafer grooving. Ngokubonelela ngozinzo, ukushukuma okumanzi, ukuxhathisa utshintsho lobushushu, kunye nokubonelela ngokuqina kwexesha elide, iziseko zoomatshini begranite zinegalelo ekusebenzeni okuchaneke ngakumbi, okusebenzayo, kunye nokuthembekileyo kwe-wafer grooving. Xa uqwalasela ukuphuculwa okanye ukuthengwa okutsha kwezixhobo ze-wafer grooving, ukukhetha umatshini onomgangatho ophezulu we-granite ochanekileyo, njengalawo avela kwi-ZHHIMG®, sisigqibo esilumkileyo esinokuphucula kakhulu umgangatho kunye nemveliso yokuvelisa i-semiconductor.
Ixesha lokuposa: Jun-03-2025