Kwintsimi yezixhobo zokulungisa ngokuchanekileyo, umgangatho we-laser bonding of granite bases uchaphazela ngokuthe ngqo ukuzinza kwezixhobo. Nangona kunjalo, amashishini amaninzi awele kwingxaki yokuhla kokuchaneka kunye nokugcinwa rhoqo ngenxa yokungahoywa kweenkcukacha eziphambili. Eli nqaku licazulule ngokunzulu imingcipheko esemgangathweni ukukunceda uphephe imingcipheko efihliweyo kunye nokuphucula ukusebenza kakuhle kwemveliso.
I. Iziphene zeNkqubo yeBonding: "Indlela efihliweyo" yoMbulali ochanekileyo
Ubunzima obungalinganiyo bomaleko wokuncamathelisa bubangela ukuba i-deformation ingalawuleki
Inkqubo yokudibanisa i-laser engeyiyo eyomgangatho ithanda ukubangela ukutenxa kobunzima bomaleko wokuncamathelisa odlula ±0.1mm. Kuvavanyo lwebhayisikili ye-thermal, umehluko kwi-coefficient yokwandisa phakathi kwe-adhesive layer kunye ne-granite (malunga ne-20 × 10⁻⁶/℃ ye-adhesive layer kunye ne-5 × 10⁻⁶/℃ kuphela yegranite) iya kubangela ukuguqulwa komgca we-0.01mm / m. Ngenxa yomaleko wokuncamathelisa ongqindilili ngokugqithisileyo, impazamo yokumisa i-Z-axis yefektri ethile yesixhobo sokubona iye yawohloka ukusuka ku-±2μm ukuya ku-±8μm emva kokuba isixhobo sisebenze iinyanga ezi-3.
2. Uxinzelelo loxinzelelo lukhawulezisa ukusilela kwesakhiwo
Ukudibanisa okungahambi kakuhle kukhokelela ekuhanjisweni koxinzelelo olungalinganiyo, ukwenza uxinzelelo lwendawo olungaphezulu kwe-30MPa kumda wesiseko. Xa izixhobo zingcangcazela ngesantya esiphezulu, ii-microcracks ziqhele ukwenzeka kwindawo yoxinzelelo. Ityala leziko lokulungisa i-automotive mold libonisa ukuba inkqubo yokudibanisa i-process defect inciphisa ubomi benkonzo yesiseko nge-40% kunye neendleko zokugcina zinyuka nge-65%.
Ii. Umgibe wokuthelekisa izinto: Ukungahoywa "Ubuthathaka obubulalayo"
Iresonance ibangelwa kukuxinana kwegranite engafikeleli kumgangatho
Ukusebenza okudambisayo komgangatho ophantsi wegranite (ubuninzi <2600kg/m³) behle nge-30%, kwaye ayikwazi ukufunxa ngokufanelekileyo amandla phantsi kwe-vibration ye-high-frequency vibration (20-50Hz) ngexesha lokulungiswa kwelaser. Uvavanyo lokwenyani lwefektri yePCB lubonisa ukuba xa usebenzisa isiseko segranite esinoxinaniso olusezantsi, izinga lomphetho we-chipped ngexesha lokugrumba liphezulu ukuya kutsho kwi-12%, ngelixa elo lemathiriyeli ekumgangatho ophezulu iyi-2% kuphela.
2. I-adhesive inokumelana nokushisa okwaneleyo
Izinto ezincamathelayo eziqhelekileyo ziyakwazi ukumelana namaqondo obushushu angaphantsi kwe 80℃. Kwimeko yobushushu obuphezulu be-laser processing (kwindawo edlula i-150 ℃), i-adhesive layer ithambile, ibangela ukuba isakhiwo sesiseko sikhululeke. Ishishini elithile le-semiconductor lenze umonakalo kwiintloko ze-laser ezixabisa izigidi ngenxa yokusilela kwezinto zokuncamathelisa.
Iii. Umngcipheko weziQinisekiso ezilahlekileyo: Iindleko ezifihlakeleyo "zeziMveliso eziThathu-eZintathu"
Isiseko ngaphandle kwe-CE kunye nesatifikethi se-ISO sifihla iingozi ezinokubakho zokhuseleko:
I-radioactivity egqithisileyo: Igranite engabhaqwanga inokukhupha irhasi yeradon, ibeka isoyikiso kwimpilo yabasebenzi.
Ukumakishwa kobuxoki bomthamo wokuthwala umthwalo: Owona mthamo womthwalo ungaphantsi kwe-60% yexabiso eliphawulweyo, elikhokelela kumngcipheko wokuchithwa kwezixhobo.
Ukungathotyelwa kokhuseleko lokusingqongileyo: Izinto ezincamathelayo ezine-VOCS zingcolisa indawo yokusebenzela kwaye zijongene nezohlwayo zokukhuselwa kwendalo.
Iv. Isikhokelo sokuNqanda imigibe: "Umthetho wegolide" woLawulo loMgangatho
✅ Ukuhlolwa kweMaterial kabini: Ubuninzi beGranite (≥2800kg/m³) kunye nengxelo yovavanyo lwe-radioactivity iyafuneka;
✅ Umboniso wenkqubo: Khetha ababoneleli abasebenzisa i-laser interferometer ukujonga ubukhulu be-adhesive (impazamo ≤±0.02mm);
✅ Uvavanyo lokulinganisa: ** ukuhamba ngebhayisikile nge-thermal (-20 ° C ukuya ku-80 ° C) + ukungcangcazela (5-50Hz) ** idatha yovavanyo oluphindwe kabini iyafuneka;
✅ Gqibezela iSiqinisekiso: Qinisekisa ukuba imveliso ine-CE, ISO 9001 kunye nesatifikethi se-SGS yokusingqongileyo.
Ixesha lokuposa: Jun-13-2025