Kwi-wave yophuculo loshishino lwe-LED ukuya kubuchwepheshe be-LED, ukuchaneka kwezixhobo zokubophelela kunquma ngqo isivuno sokupakishwa kwetshiphu kunye nokusebenza kwemveliso. I-ZHHIMG, kunye nokudibanisa okunzulu kwezinto zesayensi kunye nokuveliswa ngokuchanekileyo, ibonelela ngenkxaso ephambili yezixhobo ze-LED zokufa kwaye ibe yinto ebalulekileyo yokuqhubela phambili iteknoloji kwishishini.
Ultra-high rigidity kunye nokuzinza: Ukuqinisekisa micron-level die bonding ukuchaneka
Inkqubo ye-die bonding ye-leds idinga ukudibanisa okuchanekileyo kwee-chips ezinobungakanani be-micron (kunye nobukhulu obuncinane bufikelela kwi-50μm×50μm) kwi-substrate. Nakuphi na ukuguqulwa kwesiseko kunokubangela ukuba i-die bonding itshintshe. Ubuninzi bezinto ze-ZHHIMG zifikelela kwi-2.7-3.1g/cm³, kwaye amandla ayo oxinzelelo adlula i-200MPa. Ngethuba lokusebenza kwezixhobo, inokuxhathisa ngokufanelekileyo ukungcangcazela kunye nokutshitshiswa okwenziwe yintshukumo ephezulu ye-frequency ye-die bonding head (ukuya kumaxesha angama-2000 ngomzuzu). Umlinganiselo wangempela weshishini elikhokelayo le-LED libonisa ukuba izixhobo zokufa zisebenzisa isiseko se-ZHHIMG ziyakwazi ukulawula i-chip offset ngaphakathi kwe-± 15μm, eyi-40% ephezulu kuneyo zixhobo zesiseko zendabuko kwaye ihlangabezana ngokupheleleyo neemfuno eziqinileyo zomgangatho we-JEDEC J-STD-020D wokuchaneka kwe-die bonding.
Uzinzo olubalaseleyo lwe-thermal: Ukujongana nomngeni wokunyuka kobushushu besixhobo
Ukusebenza kwexesha elide kwezixhobo zokubopha i-die kunokubangela ukunyuka kobushushu bendawo (ukuya kuthi ga kwi-50 ℃), kunye nokwandiswa kwe-thermal yezinto eziqhelekileyo kunokutshintsha indawo ehambelanayo phakathi kwentloko yokufa kunye ne-substrate. I-coefficient yokwandiswa kwe-thermal ye-ZHHIMG iphantsi njenge (4-8) × 10⁻⁶/℃, esisisiqingatha kuphela sentsimbi. Ngexesha eliqhubekayo le-8-iyure yokusebenza okuphezulu, ukuguqulwa kwe-dimensional yesiseko se-ZHHIMG yayingaphantsi kwe-0.1μm, iqinisekisa ulawulo oluchanekileyo loxinzelelo lwe-die bonding kunye nokuphakama ukukhusela umonakalo we-chip okanye i-solder embi ebangelwa yi-thermal deformation. Idatha evela kwimizi-mveliso yokupakisha ye-LED yaseTaiwan ibonisa ukuba emva kokusebenzisa isiseko se-ZHHIMG, izinga le-defety defect defect lehla ukusuka kwi-3.2% ukuya kwi-1.1%, igcina ngaphezu kwe-10 yezigidi ze-yuan kwiindleko ngonyaka.
Iimpawu eziphezulu zokudambisa: Ukuphelisa ukuphazamiseka kokungcangcazela
I-20-50Hz vibration eyenziwa yi-high-speed movement ye-die die head, ukuba ayinqanyulwanga ngexesha, iya kuchaphazela ukuchaneka kokubekwa kwe-chip. Isakhiwo sekristale sangaphakathi se-ZHHIMG sinikezela ngokusebenza okugqwesileyo kokudambisa, kunye nomlinganiselo wokudambisa we-0.05 ukuya kwi-0.1, eyi-5 ukuya ku-10 amaxesha ezinto zetsimbi. Ingqinwe ngokulinganisa kwe-ANSYS, inokuthoba i-vibration amplitude ngaphezu kwe-90% ngaphakathi kwe-0.3 imizuzwana, iqinisekisa ngokufanelekileyo ukuzinza kwenkqubo yokudibanisa ukufa, ukwenza i-chip bonding Angle impazamo engaphantsi kwe-0.5 °, kwaye ihlangabezana neemfuno ezingqongqo zee-chips ze-LED zedigri ye-tilt.
Uzinzo lweMichiza: Ukulungelelaniswa neemeko zemveliso ezinzima
Kwiiworkshops zokupakisha ze-LED, iikhemikhali ezifana ne-fluxes kunye nee-agent zokucoca zihlala zisetyenziswa. Izinto ezisisiseko eziqhelekileyo zixhomekeke kwi-corrosion, ezinokuchaphazela ukuchaneka kwazo. I-ZHHIMG yenziwe ngamaminerali afana ne-quartz kunye ne-feldspar. Ineempawu zeekhemikhali ezizinzileyo kunye nokuchasana okugqwesileyo kwi-asidi kunye ne-alkali corrosion. Akukho ukusabela kweekhemikhali ezicacileyo ngaphakathi koluhlu lwe-pH lwe-1 ukuya kwe-14. Ukusetyenziswa kwexesha elide akuyi kubangela ukungcoliswa kwe-ion yensimbi, ukuqinisekisa ukucoceka kwendawo yokudibanisa i-die kunye nokuhlangabezana neemfuno ze-ISO 14644-1 imigangatho yokucoceka kweklasi ye-7, inika isiqinisekiso sokuthembeka okuphezulu kwe-LED ukupakishwa.
Ukuchaneka kwekhono lokucubungula: Ukufezekisa indibano echanekileyo ephezulu
Ukuxhomekeka kwi-teknoloji yokucubungula i-ultra-precision, i-ZHHIMG inokulawula ukunyanzeliswa kwesiseko ngaphakathi kwe-± 0.5μm / m kunye nobunzima bomhlaba u-Ra≤0.05μm, ukubonelela ngokufakela okuchanekileyo kweereferensi zamacandelo achanekileyo afana neentloko ezibophelelayo zokufa kunye neenkqubo zombono. Ngokudityaniswa komthungo kunye nezikhokelo ezichanekileyo ezichanekileyo (ukuphindaphinda ukuchaneka kokubeka ± 0.3μm) kunye ne-laser rangefinders (isigqibo se-0.1μm), ukuchaneka kwendawo yonke yezixhobo zokudibanisa i-die kuye kwaphakanyiswa kwinqanaba elikhokelayo kushishino, ukuququzelela impumelelo yezobuchwepheshe kumashishini e-LED.
Kwixesha langoku lokuphucula ngokukhawuleza kwishishini le-LED, i-ZHHIMG, isebenzise iingenelo zayo ezimbini ekusebenzeni kwezinto kunye neenkqubo zokuvelisa, ibonelela ngezisombululo ezizinzile nezithembekileyo ezichanekileyo zezixhobo zokudibanisa ukufa, ukukhuthaza ukupakishwa kwe-LED ngokubhekiselele ekuchanekeni okuphezulu kunye nokusebenza kakuhle, kwaye ibe yinto ephambili yokuqhuba ukuphindaphinda kwezobuchwepheshe kwishishini.
Ixesha lokuposa: May-21-2025