Kwixesha lokuphuculwa kwetekhnoloji ye-LED kushishino lwe-LED, ukuchaneka kwezixhobo ze-die bonding kumisela ngokuthe ngqo isivuno sokupakisha iitshiphusi kunye nokusebenza kwemveliso. I-ZHHIMG, ngokudityaniswa kwayo okunzulu kwesayensi yezinto kunye nokuveliswa kokuchaneka, inika inkxaso ephambili kwizixhobo ze-LED die bonding kwaye ibe yinto ebalulekileyo eqhuba ubuchule bobuchwepheshe kushishino.
Ukuqina kunye nozinzo oluphezulu kakhulu: Ukuqinisekisa ukuchaneka kokubopha kwe-micron kwinqanaba le-micron
Inkqubo yokubopha ii-die yama-LED ifuna ukubopha okuchanekileyo kwee-chips ezinobukhulu be-micron (ezincinci kakhulu zifikelela kwi-50μm×50μm) kwi-substrate. Naluphi na uguquko lwesiseko lunokubangela ukuba i-die bonding itshintshe. Ubuninzi bezinto ze-ZHHIMG bufikelela kwi-2.7-3.1g/cm³, kwaye amandla ayo okucinezela adlula i-200MPa. Ngexesha lokusebenza kwesixhobo, sinokumelana ngempumelelo nokungcangcazela kunye nokothuka okubangelwa yintshukumo ephezulu yentloko yokubopha ii-die (ukuya kuthi ga kwi-2000 amaxesha ngomzuzu). Ukulinganiswa kwangempela kweshishini eliphambili le-LED kubonisa ukuba isixhobo sokubopha ii-die esisebenzisa isiseko se-ZHHIMG sinokulawula i-chip offset ngaphakathi kwe-±15μm, ephezulu ngama-40% kunezixhobo zesiseko zendabuko kwaye ihlangabezana ngokupheleleyo neemfuno ezingqongqo zomgangatho we-JEDEC J-STD-020D wokuchaneka kwe-die bonding.
Uzinzo olubalaseleyo lobushushu: Ukujongana nomceli mngeni wokunyuka kobushushu bezixhobo
Ukusebenza kwexesha elide kwezixhobo zokubopha iidayi kunokubangela ukunyuka kobushushu bendawo (ukuya kuthi ga kwi-50℃), kwaye ukwanda kobushushu bezinto eziqhelekileyo kunokutshintsha indawo ehambelanayo phakathi kwentloko yokubopha iidayi kunye ne-substrate. I-coefficient yokwandiswa kobushushu be-ZHHIMG iphantsi njenge-(4-8) ×10⁻⁶/℃, eyisiqingatha kuphela sesinyithi esityhidiweyo. Ngexesha lokusebenza okuqhubekekayo kweeyure ezi-8, utshintsho lobukhulu besiseko se-ZHHIMG lwalungaphantsi kwe-0.1μm, okuqinisekisa ulawulo oluchanekileyo loxinzelelo lwe-die bonding kunye nokuphakama ukuthintela umonakalo we-chip okanye ukunyibilika okubi okubangelwa kukuguquka kobushushu. Idatha evela kumzi-mveliso wokupakisha we-LED waseTaiwan ibonisa ukuba emva kokusebenzisa isiseko se-ZHHIMG, izinga lokukhubazeka kwe-die bonding lehle ukusuka kwi-3.2% ukuya kwi-1.1%, okonga ngaphezulu kwe-10 yezigidi zeeyuan kwiindleko ngonyaka.
Iimpawu eziphezulu zokudambisa: Susa ukuphazamiseka kokungcangcazela
Ukungcangcazela kwe-20-50Hz okuveliswa kukushukuma kwesantya esiphezulu kwentloko ye-die die, ukuba akuncitshiswanga ngexesha, kuya kuchaphazela ukuchaneka kokubekwa kwe-chip. Ulwakhiwo lwangaphakathi lwekristale ye-ZHHIMG luyinika ukusebenza okugqwesileyo kokufunxa, kunye nomlinganiselo wokufunxa we-0.05 ukuya kwi-0.1, ophindwe kahlanu ukuya kwi-10 kunezixhobo zesinyithi. Iqinisekiswe yi-ANSYS simulation, inokunciphisa i-vibration amplitude ngaphezulu kwe-90% kwimizuzwana eyi-0.3, iqinisekisa ngokufanelekileyo uzinzo lwenkqubo yokufunxa i-die, okwenza i-chip bonding Angle impazamo ibe ngaphantsi kwe-0.5°, kwaye ihlangabezana neemfuno ezingqongqo zee-chips ze-LED ze-tilt degree.
Uzinzo lweekhemikhali: Iyakwazi ukuziqhelanisa neemeko zemveliso ezinzima
Kwiiworkshop zokupakisha ze-LED, iikhemikhali ezifana ne-fluxes kunye nee-agents zokucoca zihlala zisetyenziswa. Izixhobo eziqhelekileyo zesiseko zidla ngokugqwala, nto leyo enokuchaphazela ukuchaneka kwazo. I-ZHHIMG yenziwe ngeeminerali ezifana ne-quartz kunye ne-feldspar. Ineempawu zekhemikhali ezizinzileyo kunye nokumelana okuhle kakhulu ne-asidi kunye ne-alkali corrosion. Akukho mpendulo yekhemikhali ecacileyo ngaphakathi koluhlu lwe-pH ukusuka kwi-1 ukuya kwi-14. Ukusetyenziswa ixesha elide akuyi kubangela ungcoliseko lwe-ion yesinyithi, kuqinisekisa ukucoceka kwendawo yokubopha idayi kwaye kuhlangabezana neemfuno zemigangatho yegumbi lokucoca le-ISO 14644-1 Class 7, okubonelela ngesiqinisekiso sokupakisha kwe-LED okuthembekileyo kakhulu.
Ubuchule bokucubungula ngokuchanekileyo: Fumana indibano echanekileyo kakhulu
Ixhomekeke kubuchwepheshe bokucubungula obuchanekileyo kakhulu, i-ZHHIMG inokulawula ukuthamba kwesiseko ngaphakathi kwe-±0.5μm/m kunye noburhabaxa bomphezulu i-Ra≤0.05μm, ibonelela ngeereferensi ezichanekileyo zokufakela izinto ezichanekileyo ezifana neentloko ze-die bonding kunye neenkqubo zokubona. Ngokudityaniswa okungenamthungo kunye nezikhokelo ezichanekileyo zomgca (ukuchaneka kokuphinda ukubeka ±0.3μm) kunye ne-laser rangefinders (isisombululo se-0.1μm), ukuchaneka kokubekwa ngokubanzi kwezixhobo ze-die bonding kuphakanyiswe kwinqanaba eliphambili kushishino, okwenza kube lula ukuphumelela kwezobuchwepheshe kumashishini e-LED kwicandelo le-LED.
Kule mihla yokuphuculwa okukhawulezileyo kwishishini le-LED, i-ZHHIMG, isebenzisa iingenelo zayo ezimbini kwiinkqubo zokusebenza kwezinto kunye nokuvelisa, ibonelela ngezisombululo ezizinzileyo nezithembekileyo zesiseko esichanekileyo sezixhobo zokubopha iidayi, ikhuthaza ukupakishwa kwe-LED ukuya kulungelelwano oluphezulu kunye nokusebenza kakuhle, kwaye ibe yinxalenye ephambili yokuqhubela phambili ubuchwepheshe kwishishini.
Ixesha leposi: Meyi-21-2025