Ngaphantsi kweemfuno ezingqongqo zokuchaneka okuphezulu kunye nokuthembeka okuphezulu kwishishini le-semiconductor, nangona i-granite yenye yezinto eziphambili, iipropati zayo nazo zizisa imida ethile. Oku kulandelayo zizinto zayo ezingeloncedo kunye nemingeni kwizicelo ezibonakalayo:
Okokuqala, izinto eziphathekayo zi-brittle kakhulu kwaye kunzima ukusetyenzwa
Umngcipheko wokuqhekeka: I-Granite ngokuyimfuneko ilitye lendalo kunye ne-micro-cracks yendalo kunye nemida ye-mineral particles ngaphakathi, kwaye yinto eqhelekileyo ye-brittle. Kwi-ultra-precision machining (njenge-nanoscale grinding kunye ne-complex curved surface processing), ukuba amandla angalingani okanye i-parameters processing parameters ayifanelekanga, iingxaki ezifana ne-chipping kunye ne-microcrack propagation zivame ukwenzeka, ezikhokelela ekukhutsheni komsebenzi.
Ukusebenza okuphantsi kokusebenza: Ukunqanda ukuphuka kwe-brittle, iinkqubo ezikhethekileyo ezifana nokusila ngesantya esisezantsi kunye namavili okusila idayimane kunye nokupolishwa kwemagnetorheological kuyafuneka. Umjikelo processing 30% ukuya 50% ubude ngaphezu kokuba izinto zetsimbi, kunye neendleko zotyalo-mali izixhobo ziphezulu (umzekelo, ixabiso iziko machining uqhagamshelwano ezintlanu-axis idlula 10 million yuan).
Unyino lwesakhiwo esintsonkothileyo: Kunzima ukuvelisa izakhiwo ezingenanto ezikhaphukhaphu ngokuphosa, ukubunjwa kunye nezinye iinkqubo. Isetyenziswa kakhulu kwiimilo zejometri ezilula ezifana neepleyiti kunye neziseko, kwaye ukusetyenziswa kwayo kunqunyelwe kwizixhobo ezifuna inkxaso engaqhelekanga okanye ukuhlanganiswa kwemibhobho yangaphakathi.
Okwesibini, ukuxinana okuphezulu kukhokelela kumthwalo onzima kwisixhobo
Kunzima ukuyiphatha kunye nokuyifaka: Ubuninzi begranite bumalunga ne-2.6-3.0 g/cm³, kwaye ubunzima bayo buyi-1.5-2 umphinda-phinde ngentsimbi etyhidiweyo phantsi komthamo ofanayo. Ngokomzekelo, ubunzima besiseko se-granite kumatshini we-photolithography bunokufikelela kwiitoni ezi-5 ukuya kwezi-10, ezifuna izixhobo zokunyusa ezizinikeleyo kunye neziseko zobungqina bokuthuthumela, okwandisa iindleko zokwakhiwa kwefektri kunye nokuthunyelwa kwezixhobo.
I-Dynamic response lag: I-inertia ephezulu inciphisa ukukhawuleziswa kweendawo ezihambayo zezixhobo (ezifana neerobhothi zokudlulisa i-wafer). Kwiimeko apho kufuneka ukuqala ngokukhawuleza kunye nokuyeka (ezifana nezixhobo zokuhlola isantya esiphezulu), kunokuchaphazela isigqi sokuvelisa kunye nokunciphisa ukusebenza kakuhle.
Okwesithathu, iindleko zokulungiswa kunye nokuphindaphinda ziphezulu
Iziphene kunzima ukuzilungisa: Ukuba ukunxitywa komphezulu okanye umonakalo wokungqubana kwenzeka ngexesha lokusetyenziswa, kufuneka ubuyiselwe kumzi-mveliso ukuze ulungiswe ngezixhobo zokusila zobuchwephesha, ezingenakuphathwa ngokukhawuleza kwisiza. Ngokwahlukileyo, amacandelo esinyithi anokulungiswa ngokukhawuleza ngeendlela ezifana ne-spot welding kunye ne-laser cladding, okukhokelela ekunciphiseni ixesha elifutshane.
Umjikelo wokuphindaphinda uyilo lude: Umahluko kwimithanjana yegranite yendalo inokubangela ukuguquguquka okuncinci kwiipropathi zezinto ezibonakalayo (ezifana nokwandiswa kwe-thermal coefficient kunye ne-damping ratio) yeebhetshi ezahlukeneyo. Ukuba ukuguqulwa koyilo lwezixhobo, izinto eziphathekayo kufuneka ziphinde zifaniswe, kwaye umjikelo wokuqinisekisa uphando kunye nophuhliso lude.
Iv. Izibonelelo eziNcinane kunye nemingeni yokusiNgqongileyo
Ilitye lendalo alinakuphinda lihlaziywe: Igranite ekumgangatho ophezulu (efana ne "Jinan Green" kunye ne "Sesame Black" esetyenziswa kwi-semiconductors) ixhomekeke kwimithambo ethile, inoovimba abambalwa kwaye ukumbiwa kwayo kuthintelwe yimigaqo-nkqubo yokhuseleko lokusingqongileyo. Ngokwandiswa kweshishini le-semiconductor, kunokubakho umngcipheko wonikezelo lwempahla ekrwada olungazinzanga.
Ukucubungula imiba yongcoliseko: Ngexesha leenkqubo zokusika kunye nokusila, uthuli oluninzi lwegranite (oluqulethe i-silicon dioxide) luyaveliswa. Ukuba ayiphathwa kakuhle, inokubangela i-silicosis. Ngaphezu koko, amanzi amdaka kufuneka aphathwe ngentlenga ngaphambi kokuba akhululwe, okonyusa utyalo-mali lokukhuselwa kwendalo.
Ntlanu. Ukungahambelani ngokwaneleyo kunye neenkqubo ezivelayo
Unyino lwemeko yevacuum: Ezinye iinkqubo zesemiconductor (ezifana ne-vacuum coating kunye ne-electron beam lithography) zifuna ukugcinwa kwemeko ephezulu yokufunxa ngaphakathi kwesixhobo. Nangona kunjalo, i-micro-pores kumphezulu wegranite inokuthi ibhengeze iimolekyuli zegesi, ezikhutshwa kancinci kwaye zichaphazele uzinzo lwedigri yevacuum. Ke ngoko, unyango olongezelelweyo lokuxinaniswa komphezulu (njengokufakwa kwe-resin) luyimfuneko.
Imiba yokuhambelana kwe-Electromagnetic: IGranite sisixhobo sokugquma. Kwiimeko apho ukukhutshwa kombane omileyo okanye ukukhuselwa kwe-electromagnetic kufuneka (ezifana neqonga le-wafer electrostatic adsorption), iingubo zentsimbi okanye iifilimu eziqhutywayo kufuneka zidityaniswe, zinyuse ukuntsonkotha kwesakhiwo kunye neendleko.
Isicwangciso sokuphendula kwishishini
Ngaphandle kwezi ntsilelo zikhankanywe ngasentla, ishishini le-semiconductor liye lenza ngokuyinxenye iintsilelo zegranite ngokusebenzisa innovation yetekhnoloji:
Uyilo lwesakhiwo esihlanganisiweyo: Yamkela ukudibanisa "isiseko segranite + isakhelo sesinyithi", kuthathelwa ingqalelo zombini ukuqina kunye nokukhaphukhaphu (umzekelo, umenzi othile womatshini we-photolithography ufaka i-aluminium alloy honeycomb kwisiseko segranite, ukunciphisa ubunzima ngama-40%).
Iimathiriyeli ezenziweyo ezenziweyo ezizezinye: Phuhlisa i-ceramic matrix composites (ezifana ne-silicon carbide ceramics) kunye namatye enziwe nge-epoxy resin-based ukulinganisa ukuzinza kwe-thermal kunye nokumelana nokungcangcazela kwegranite, ngelixa uphucula ukuguquguquka kokusebenza.
Itekhnoloji yokucubungula ngobukrelekrele: Ngokuzisa i-algorithms ye-AI yokwandisa indlela yokucubungula, ukulinganisa uxinzelelo ukuqikelela ubungozi bokuqhekeka, kunye nokudibanisa ukubonwa kwe-intanethi ukulungelelanisa iiparamitha ngexesha langempela, izinga le-scrap processing liye lancitshiswa ukusuka kwi-5% ukuya ngaphantsi kwe-1%.
Isishwankathelo
Iziphene zegranite kwishishini le-semiconductor zisuka kumdlalo phakathi kweempawu zayo zendalo kunye neemfuno zemizi-mveliso. Ngenkqubela phambili yetekhnoloji kunye nophuhliso lwezinye izixhobo, iimeko zokusetyenziswa kwayo zinokucutheka ngokuthe ngcembe ziye “kwicandelo lereferensi engenakubuyiselwa endaweni” (efana ne-hydrostatic guide rails yoomatshini befotolithography kunye ne-ultra-precision measurement platforms), ngelixa ngokuthe ngcembe inika indlela kwizinto zobunjineli ezibhetyebhetye kwizinto ezingabalulekanga kulwakhiwo. Kwixesha elizayo, indlela yokulinganisa ukusebenza, iindleko kunye nokuzinza kuya kuba ngumxholo oqhubekayo ukuvavanya ishishini.
Ixesha lokuposa: May-24-2025