Kwikhonkco eliphambili lokwenziwa kwe-chip - i-wafer scanning, ukuchaneka kwezixhobo kugqiba umgangatho we-chip. Njengenxalenye ebalulekileyo yezixhobo, ingxaki yokwandisa i-thermal yesiseko somatshini we-granite uye watsala ingqalelo enkulu.
I-coefficient yokwandiswa kwe-thermal ye-granite ngokuqhelekileyo phakathi kwe-4 kunye ne-8 × 10⁻⁶/℃, ephantsi kakhulu kuneentsimbi kunye ne-marble. Oku kuthetha ukuba xa iqondo lobushushu litshintsha, ubukhulu bayo butshintsha kancinci. Nangona kunjalo, kufuneka kuqatshelwe ukuba ukwanda kwe-thermal ephantsi akuthethi ukuba akukho kwandiswa kwe-thermal. Phantsi kokuguquguquka okugqithisileyo kobushushu, nokona kwandiswa okuncinci kunokuchaphazela ukuchaneka kwe-nanoscale ye-wafer scanning.
Ngexesha lenkqubo yokuskena i-wafer, kukho izizathu ezininzi zokuvela kokwandiswa kwe-thermal. Ukuguquguquka kwamaqondo obushushu kwindawo yokusebenzela, ubushushu obuveliswa kukusebenza kwamacandelo ezixhobo, kunye nobushushu obuphezulu kwangoko obuziswa yi-laser processing konke kuya kubangela ukuba isiseko segranite "sandise kwaye sivume ngenxa yokutshintsha kwamaqondo obushushu". Emva kokuba isiseko sifumana ukwandiswa kwe-thermal, ukuthe tye kwesikhokelo sikaloliwe kunye nokunyuka kweplatifomu kunokuphambuka, kubangele ukunyakaza okungahambi kakuhle kwetafile ye-wafer. Amacandelo okukhanya axhasayo nawo aya kutshintsha, abangele ukuba umqadi wokuskena "ujike". Ukusebenza ngokuqhubekayo ixesha elide kuya kuqokelela iimpazamo, okwenza ukuchaneka kube kubi nakakhulu.
Kodwa ungakhathazeki. Abantu sele benezisombululo. Ngokwezinto eziphathekayo, i-granite veins ene-coefficient ephantsi yokwandiswa kwe-thermal iya kukhethwa kwaye ixhomekeke kunyango lokuguga. Ngokubhekiselele kulawulo lobushushu, iqondo lobushushu leworkshop lilawulwa ngokuchanekileyo kwi-23±0.5℃ okanye nangaphantsi, kwaye isixhobo esisebenzayo sokuphelisa ubushushu siya kuyilwa isiseko. Ngokumalunga noyilo lwesakhiwo, izakhiwo ze-symmetrical kunye neenkxaso eziguquguqukayo ziyamkelwa, kwaye ukubeka iliso ngexesha langempela kuqhutyelwa ngeenzwa zeqondo lokushisa. Iimpazamo ezibangelwa yi-thermal deformation zilungiswa ngokuguquguqukayo nge-algorithms.
Izixhobo eziphezulu ezifana noomatshini be-ASML lithography, ngokusebenzisa ezi ndlela, gcina umphumo wokwandiswa kwe-thermal yesiseko se-granite ngaphakathi koluhlu oluncinci kakhulu, okwenza ukuba i-wafer scanning ichaneke ukufikelela kwinqanaba le-nanometer. Ke ngoko, nje ukuba ilawulwa ngokufanelekileyo, isiseko segranite sihlala silukhetho oluthembekileyo lwezixhobo zokuskena i-wafer.
Ixesha lokuposa: Jun-12-2025