Utshintsho olukhawulezileyo lwetekhnoloji ye-Augmented Reality (AR) kunye ne-Virtual Reality (VR) lubeka iimfuno ezingaqhelekanga kwizinto ezibonakalayo. Eyona nto iphambili kwezi nkqubo ziphambili kukukho into ebalulekileyo: i-wafer yeglasi echanekileyo. Njengoko izixhobo zisiba ncinci, zilula, kwaye zintywilisela ngakumbi, iinkcukacha zezixhobo zeglasi ezizixhasayo ziya zisiba nzima ngakumbi.
Kubayili beenkqubo ze-optical kunye nabavelisi, ukuqonda ezi ngxaki zobugcisa akupheleli nje ekufumaneni izixhobo—kungokuvumela isizukulwana esilandelayo sekhompyutha yendawo. Kwi-ZHHIMG, sivala umsantsa phakathi kwesayensi yezinto eziluhlaza kunye nokusebenza kwe-optical. Nazi iinkcukacha ezibalulekileyo ekufuneka uzazi xa ukhetha ii-glass wafers zezicelo ze-AR/VR.
Izinto zeSubstrate kunye neRefractive Index
Ukukhethwa kwezinto zeglasi kulawula indlela yokukhanya kunye nefom yesixhobo sokugqibela.
- Iglasi ye-High-Refractive-Index (n > 1.8): Kwizibonisi ze-AR ezisekelwe kwi-waveguide, ukukhanya kufuneka kudityaniswe ngokufanelekileyo kwaye kukhokelwe kwi-total internal reflection. Iglasi ye-High-index ivumela ii-injini ezincinci, ezikhaphukhaphu ze-optical kunye neendawo ezibanzi zokujonga (FOV).
- I-Fused Silica: Ikhethwa kakhulu kwi-UV laser processing kunye nezicelo ezifuna uzinzo olukhulu lobushushu. I-thermal expansion coefficient yayo ephantsi iqinisekisa ukuba ukusebenza kwe-optical kuhlala kufana nokuba kukhanyiswa ngamandla aphezulu.
- Ukufaniswa kobushushu: Kwi-optics ye-wafer-level, i-substrate yeglasi idla ngokufuna ukubotshelelwa kwii-sensors ze-silicon okanye ii-displays. Ukukhetha ukwakheka kweglasi ene-thermal expansion coefficient ehambelana ne-silicon (malunga ne-2.6 × 10⁻⁶/K) kubalulekile ukuthintela ukugoba okanye ukuqhekeka ngexesha lokujikeleza kobushushu.
Ukunyamezelana Okunemilinganiselo kunye noMgangatho woMphezulu
Kwicandelo le-wafer level optics, ukuchaneka kulinganiswa ngee-microns kunye nee-nanometers. Iinkcukacha zeglasi zorhwebo eziqhelekileyo azisebenzi apha.
- Ububanzi kunye noBukhulu: Iifomathi eziqhelekileyo ziquka ii-wafers ezingama-200mm kunye ne-300mm, ezinobukhulu obuqala kwi-0.3mm ukuya kwi-5mm.
- Ukunyamezelana Nobukhulu: Sigcina ukunyamezelana okuqinileyo, okuqhele ukuba yi-±5µm, ukuqinisekisa ukuba iyafana kwi-wafer.
- Utshintsho Lobukhulu Obupheleleyo (TTV): I-TTV ye-<5µm ibalulekile ekugcineni ukugxila kunye nokuthintela ukuphazamiseka kwe-optical kwiindawo zokudibanisa ze-optical.
- Ukuthamba: Ukuthintela ukugqwetheka komfanekiso, i-bow kunye ne-warp kufuneka zilawulwe zibe ngaphantsi kwama-20µm kunye ne-<5µm ngokwahlukeneyo.
Ukugqitywa komphezulu kunye noburhabaxa
Umgangatho womphezulu weglasi uchaphazela ngokuthe ngqo ukuhanjiswa kokukhanya kunye nokusasazeka.
- Uburhabaxa (Ra): Kwizixhobo ze-AR VR ezibonakalayo ezisebenza kakuhle, sifikelela kumaxabiso oburhabaxa bomphezulu weRa <1nm. Oku kuthamba okuphantse kube yiathomu kunciphisa ukusasazeka kokukhanya kunye nomhlwa, okuqinisekisa umahluko ophezulu kunye nokucaca.
- Umgangatho woMphezulu: Silandela imigangatho ye-MIL-PRF-13830B, sihlala sibonelela ngeglasi enomlinganiselo wokukrwela we-40-20 okanye ngaphezulu. Kwiinkqubo ezinobuthathaka kwiziphene ezifana ne-lithography okanye i-laser optics, kwanomonakalo ongaphantsi komphezulu kufuneka ususwe ngeendlela eziphambili zokupholisha.
Ukucubungula Okuphambili kunye Nokugquma
Iglasi eluhlaza sisiqalo nje. Ukusebenza kwe-wafer kuchazwa yindlela ecutshungulwa ngayo.
- Ukupholisha Amacala Amabini (i-DSP): Kubalulekile kwiizicelo ezifuna ukukhanya okubonakalayo kumacala omabini, njengeziqhekeza zemitha okanye iglasi yokugquma kwiinkqubo zeLiDAR.
- Iingubo ezichasene nokukhanya (AR): Ukuze kusetyenziswe ukukhanya okuphezulu (ngokuqhelekileyo ngaphezulu kwe-98%), iingubo ezichanekileyo ze-AR ziyafakwa. I-Spectrophotometry isetyenziselwa ukuqinisekisa ukusebenza kwengubo kwi-spectrum ebonakalayo (400-700nm) okanye ii-laser wavelengths ezithile (umz., i-940nm yokubona i-3D).
- Ukusikwa kunye nokuBunjwa ngeLaser: Kwijiyometri ezenziwe ngokwezifiso okanye i-optics engeyiyo i-circular, ukusikwa ngelaser kubonelela ngemiphetho ecocekileyo enemiqhekezo emincinci encinci, okunciphisa isidingo sokusikwa kwemiphetho emininzi.
Ukuthelekiswa kweeNdidi zeGlasi ze-AR/VR
| Ipharamitha | Iglasi eneeNgcali eziphezulu | I-Silica edibeneyo | I-Borofloat / Alkali-Aluminosilicate |
|---|---|---|---|
| Isalathisi sokuKhangela (nd) | > 1.80 | ~ 1.46 | ~ 1.52 |
| Ukwandiswa kobushushu | Iphakathi | Iphantsi kakhulu | Iphantsi |
| Isicelo esiPhambili | Izihlanganisi zeWaveguide | Iimaski ze-UV Optics | Iglasi/Izivamvo Zesigqubuthelo |
| Inzuzo ephambili | Ukwenziwa kube lula | Uzinzo lobushushu | Ixabiso/Ukuqina |
I-Metrology kunye noQinisekiso loMgangatho
Ukuqinisekisa ezi nkcukacha kufuna i-metrology yanamhlanje. Sisebenzisa i-interferometry ukulinganisa ubume be-flat kunye ne-TTV kuyo yonke indawo ye-wafer. Ukuqinisekisa ukugquma, ii-spectrophotometers zilinganisa ukudluliselwa kunye nokubonakaliswa kwii-engile ezahlukeneyo ze-incidence (AOI).
Nokuba uphuhlisa iimodyuli zokuva ze-3D zeefowuni eziphathwayo okanye ii-waveguides ezintsonkothileyo zeglasi ze-AR, umgangatho we-substrate yakho uchaza umda wokusebenza kwenkqubo yakho.
Sebenzisana neZHHIMG
Apha e-ZHHIMG, sigxile ekwenzeni ii-wafers zeglasi ezichanekileyo ezihlangabezana neemfuno ezingqongqo zoshishino lwe-optical. Ukususela ekukhetheni izinto ukuya ekugqumeni kokugqibela, sinikezela ngezisombululo ezisuka ekupheleni ukuya ekupheleni ezikunceda udlule kwimida yoko kunokwenzeka kwi-AR nakwi-VR.
Ukulungele ukuphucula uyilo lwakho lwe-optical?
Ixesha leposi: Epreli-07-2026